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Process technology and integration challenges for high performance interconnectsSANDHU, G. S.Thin solid films. 1998, Vol 320, Num 1, pp 1-9, issn 0040-6090Conference Paper

Thermal stability of Al/barrier/TiSi_x multilayer structuresLU, J. P; HSU, W. Y; HONG, Q. Z et al.Thin solid films. 1998, Vol 320, Num 1, pp 20-25, issn 0040-6090Conference Paper

TiN barrier integrity and volcano formation in W-plug applicationsPARIKH, S; AKSELROD, L; GARDNER, J et al.Thin solid films. 1998, Vol 320, Num 1, pp 26-30, issn 0040-6090Conference Paper

Experimental and numerical analysis of rapid reaction to initiate the radical chain reactions in WSix CVDCHAE, Y. K; EGASHIRA, Y; SHIMOGAKI, Y et al.Thin solid films. 1998, Vol 320, Num 1, pp 151-158, issn 0040-6090Conference Paper

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Structural change of TiN/Ti/SiO₂ multilayers by N₂ annealingHAMAMURA, H; ITOH, H; SHIMOGAKI, Y et al.Thin solid films. 1998, Vol 320, Num 1, pp 31-34, issn 0040-6090Conference Paper

Temperature dependence of the Al-fill processes for submicron-via structuresWEBER, S. J; IGGULDEN, R. C; SCHNABEL, R. F et al.Thin solid films. 1998, Vol 320, Num 1, pp 63-66, issn 0040-6090Conference Paper

The carrier gas and surface passivation effects on selectivity in chemical vapor deposition of copper filmsSEOK KIM; PARK, J.-M; CHOI, D.-J et al.Thin solid films. 1998, Vol 320, Num 1, pp 95-102, issn 0040-6090Conference Paper

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Manufacturing aspects of low pressure chemical-vapor-deposited TiN barrier layersTRAVIS, E. O; FIORDALICE, R. W.Thin solid films. 1993, Vol 236, Num 1-2, pp 325-329, issn 0040-6090Conference Paper

Nucleation and growth of chemical vapor deposition TiN films on Si (100) as studied by total refection x-ray fluorescence, atomic force microscopy, and Auger electron microscopyHEGDE, R. I; TOBIN, P. J; FIORDALICE, R. W et al.Journal of vacuum science and technology. A. Vacuum, surfaces, and films. 1993, Vol 11, Num 4, pp 1692-1695, issn 0734-2101, 2Conference Paper